Fujian, China
Business Type:
Trading Company
Main Products:
Number of Employees:
5
Year of Establishment:
2022-09-21
Management System Certification:
The company have the quality management system
Average Lead Time:
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Service, Electronic Components manufacturer / supplier in China, offering Dual Row 8-Wire IC Lead Frame High-Precision Chip Housing Model, Cqfp40 Black Ceramic Packaging IC Electronic Components High Precision Semiconductor Housing, Multilayer Ceramic Sop20 Wire Packaging Semiconductor Shell IC Electronic Components and so on.

Gold Member Since 2023

Suppliers with verified business licenses

Info marked by is verified by BV

Contact Supplier

Mr. Liu Bin

Company Profile

Watch Video
Fuzhou Xinxu Technology Co., Ltd
Fuzhou Xinxu Technology Co., Ltd
Fuzhou Xinxu Technology Co., Ltd
Fuzhou Xinxu Technology Co., Ltd
Business Type: Trading Company
Main Products: Chip packaging carrier
Number of Employees: 5
Year of Establishment: 2022-09-21
Management System Certification: The company have the quality management system
Average Lead Time: Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
BV Serial NO. :

Fuzhou Xinxu Technology Co., Ltd. Was established from 2022 to September 21. Address: Workshop 12 #, No. 28, Linsen Avenue, Qianfeng Town, Minhou County, Fuzhou City, Fujian Province. Our company is a national high-tech enterprise, a national "specialized, special, new and small giant" enterprise, a provincial innovative enterprise, a provincial leader in small, medium-sized and micro science and technology, a provincial research center for Enterprise engineering technology of ceramic packaging materials, an enterprise with intellectual property advantages in Fujian Province, a municipal enterprise technology center, and a military electronic packaging mobilization center in Nanping City, Fujian Province. At present, the company is mainly engaged in the production and research and development of Electroceramics, microelectronic packaging products and LED lighting products. Many products have won national, provincial and municipal scientific research achievement awards; The surface mounted integrated circuit low-temperature glass packaging shell was rated as a national key new product and a provincial excellent new product in 2008. The company has 3 national invention patents, 34 utility model patents, and 2 exterior design patents. The electronic packaging covers produced by the company are widely used in crystal oscillators, resonators, surface acoustic wave filters (SAW), and integrated circuits. The products are sold nationwide and exported worldwide. Integrated circuit black ceramic low-temperature glass packaging shells (CERDIP and CFP) are important domestic manufacturers, mainly used in military, automotive, medical equipment, and microelectronic packaging with high quality and reliability requirements. Our products are sold to more than ten provinces, cities, and autonomous regions, including Beijing, Shanghai, Shenzhen, Chongqing, Xi′an, Jiangsu, Gansu, Liaoning, Hunan, and Guizhou. In 2015, the company invested 10 million yuan in the new CFP packaging shell and lead frame project, supplying products to multiple countries such as the United States.

Trade Capacity

International Commercial Terms(Incoterms):
FOB, CIF, CFR
Terms of Payment:
LC, T/T, PayPal, Western Union
Average Lead Time:
Peak Season Lead Time: one month, Off Season Lead Time: within 15 workdays
Number of Foreign Trading Staff:
4
Main Markets:
North America, South America, Europe, Southeast Asia/ Mideast
Nearest Port:
Fuzhou Port
Import & Export Mode:
Exportation via agency

Partner Production Capacity

Factory Address:
No. 5, Xinyuan Road, Nanyu Town, Minhou County, Fuzhou, Fujian, China
No. of R&D Staff:
1

Send your message to this supplier

*From:
*To:
avatar Mr. Liu Bin
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now