Sop Packaging Surface Mount 48 Wire Integrated Circuit Black Ceramic Fused Shell

• shape: Flat
• Conductive Type: Normal
• Integration: Normal
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: 48
• Technics: Semiconductor IC
• Application: Specific Integrated Circuits
• Type: Digital IC
• Heat Dissipation: Excellent
• Obscurity: Excellent
• Transport Package: Carton
• Specification: 3.9mm*4.3mm
• Origin: China
• Production Capacity: 50000
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

Integrated Circuit Ceramic Flat Package(SOP type and CQFP type)
Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, and packaging process is simple, low price, high palmability. Suitable for mass production can be widely used in military and civil products, with broad market prospects and development space