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IC Electronic Components Black Ceramic 24 Wire Housing DIP Packaging

US$4.70 1,000 Pieces (MOQ)
Port:
Guangzhou, China
Production Capacity:
50000
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
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Fuzhou Xinxu Technology Co., Ltd

Fujian, China

Last Login Date:

Aug 20, 2025

Main Products:

Service, Electronic Components

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Product Description

Company Info

Basic Info.

Model NO.
24
Conductive Type
1
Integration
1
Shape
DIP
Technics
Semiconductor IC
shape
DIP
Transport Package
Carton
Origin
China

Product Description

Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass and black alumina ceramic as materials to package and protect IC chips. Black ceramic is an ideal material for various chip packaging, with good mechanical, electrical, and chemical properties. The packaging process is simple, the price is low, and the reliability is high. Suitable for mass production and widely used in military and civilian high reliability products, it has broad market prospects and development space.
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