Microcrystalline Glass Shell Qfp IC Electronic Components

• shape: Flat
• Conductive Type: Normal
• Integration: Normal
• Technics: Semiconductor IC
• Application: Specific Integrated Circuits
• Type: Digital IC
• Gold Tin Composition: Ausn8020
• Cladding Material: Nickel 3-8um, Gold Above 1.3um
• OEM: ODM
• Packaging: The Box
• Transport Package: Carton
• Origin: China
• Production Capacity: 50000

Product Description

Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass and black alumina ceramic as materials to package and protect IC chips. Black ceramic is an ideal material for various chip packaging, with good mechanical, electrical, and chemical properties. The packaging process is simple, the price is low, and the reliability is high. Suitable for mass production and widely used in civilian high reliability products, it has broad market prospects and development space.
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