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DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell pictures & photos
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
  • DIP Encapsulated Black Ceramic 20 Wire Fusion Sealed High-Precision Semiconductor Shell
shape: DIP
Conductive Type: 1
Integration: 1
Technics: Semiconductor IC
Transport Package: Carton
Origin: China

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