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  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
  • Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor
shape: DIP
Conductive Type: Normal
Integration: Normal
Technics: Semiconductor IC
Material: Copper Clad Aluminum Alloy
Performance: Bonding Force Greater Than 5g

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