Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor

• shape: DIP
• Conductive Type: Normal
• Integration: Normal
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Technics: Semiconductor IC
• Application: Specific Integrated Circuits
• Type: Digital IC
• Material: Copper Clad Aluminum Alloy
• Performance: Bonding Force Greater Than 5g
• Transport Package: Carton
• Specification: 0.5mm*0.5mm
• Origin: China
• Production Capacity: 50000
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass and black alumina ceramic as materials to package and protect IC chips. Black ceramic is an ideal material for various chip packaging, with good mechanical, electrical, and chemical properties. The packaging process is simple, the price is low, and the reliability is high. Suitable for mass production and widely used in military and civilian high reliability products, it has broad market prospects and development space.
Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass and black alumina ceramic as materials to package and protect IC chips. Black ceramic is an ideal material for various chip packaging, with good mechanical, electrical, and chemical properties. The packaging process is simple, the price is low, and the reliability is high. Suitable for mass production and widely used in military and civilian high reliability products, it has broad market prospects and development space.