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Sop Packaged Black Ceramic 14 Wire Shell Cqfp Semiconductor
| US$1.47 | 500 Pieces (MOQ) |
Port:
Guangzhou, China
Production Capacity:
50000
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Fuzhou Xinxu Technology Co., Ltd
Fujian, China
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Product Description
Company Info
Basic Info.
Model NO.
14
Conductive Type
Normal
Integration
Normal
Technics
Semiconductor IC
ODM
OEM
Heat Dissipation
Excellent
shape
Flat
Transport Package
Carton
Specification
4.3mm*6mm
Origin
China
Product Description
Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, and packaging process is simple, low price, high palmability. Suitable for mass production can be widely used in military and civil products, with broad market prospects and development spaceIntegrated Circuit Ceramic Flat Package(SOP type and CQFP type)
Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, and packaging process is simple, low price, high palmability. Suitable for mass production can be widely used in military and civil products, with broad market prospects and development space
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